HBM STAGE HEATERS are heating modules that perform bonding within the Thermal Compression Bonding(TCB) equipment. They hold and heat the wafer through a vacuum and a heater. A Polyimide heater made of Black AlN is used for thermal operations.
operating temperature
Ceramic Body < 150℃
characteristics
thermal expansion
Similar to that of Silicon
Quartz is inserted between the heater and the Invar to prevent thermal transfer to the equipment
Consists of Al₂O₃ plates capable of vacuum adsorption