Products
Electrostatic
Chucks (ESC)
overview
ESC is a key component that uses electrostatic force to secure the wafer and built-in heat circuits to control its processing temperature and temperature uniformity. BOBOO HITECH provides cleaning, repairing, and manufacturing services of ESCs with technology to bond and de-bond the electrode plate and heater.
operating temperature
AlN < 400℃
Al₂O₃ < 100℃
application
Etching
Chemical Vapor Deposition(CVD)
Physical Vapor Deposition(PVD)
Ion Implantation
types & sizes
BOBOO HITECH offers numerous design options for ESCs.
chucking type
coulomb
Chucking Force occurs between ESC and dielectric layer
Chucking Force remains independent from temperature variations
Johnsen-Rahbek
Chucking Force occurs in the Microspace between ESC and wafer
Chucking Force remains high even in low voltage operations
electrode / pole type
monopolar
Single electrode to clamp wafer
bipolar
Contrasting electrodes to clamp wafer with strong electrical attraction
Multipolar
Three different electrodes to clamp wafer with even stronger electrical attraction
ceramic sintering process
multi-layer ceramic (tape casting)
Multi-layer Electrodes & Multi-zone Heaters installed internally
hot press
Dielectric Strength : HIGH
Durability : GOOD
Plasma Resistance & Anti-Corrosion : EXCELLENT
multi-zone heaters
normal-zone
1
heating zones
multi-zone
4 ~ 300+
heating zones
coating technology
Enhancement of Corrosion Resistance and Durability through Surface Treatments
diamond-like carbon(DLC)
tiN
siC