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Electrostatic
Chucks (ESC)

overview

ESC is a key component that uses electrostatic force to secure the wafer and built-in heat circuits to control its processing temperature and temperature uniformity. BOBOO HITECH provides cleaning, repairing, and manufacturing services of ESCs with technology to bond and de-bond the electrode plate and heater.

operating temperature

AlN < 400℃

Al₂O₃ < 100℃

application

Etching
Chemical Vapor Deposition(CVD)
Physical Vapor Deposition(PVD)
Ion Implantation

types & sizes

BOBOO HITECH offers numerous design options for ESCs.

chucking type

coulomb

Chucking Force occurs between ESC and dielectric layer

Chucking Force remains independent from temperature variations

Johnsen-Rahbek

Chucking Force occurs in the Microspace between ESC and wafer

Chucking Force remains high even in low voltage operations

electrode / pole type

monopolar

Single electrode to clamp wafer

bipolar

Contrasting electrodes to clamp wafer with strong electrical attraction

Multipolar

Three different electrodes to clamp wafer with even stronger electrical attraction

ceramic sintering process

multi-layer ceramic (tape casting)

Multi-layer Electrodes & Multi-zone Heaters installed internally

hot press

Dielectric Strength : HIGH
Durability : GOOD
Plasma Resistance & Anti-Corrosion : EXCELLENT

multi-zone heaters

normal-zone

1
heating zones

multi-zone

4 ~ 300+
heating zones

coating technology

Enhancement of Corrosion Resistance and Durability through Surface Treatments

diamond-like carbon(DLC)
tiN
siC

sizes

200mm

300mm

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