Products HBM stage heaters overview HBM STAGE HEATERS are heating modules that perform bonding within the Thermo-Compression Bonding(TCB) equipment. They hold and heat the wafer through a vacuum and a heater. operating temperature AlN < 150℃ characteristics Temperature Uniformity ±1%, @100°C Flatness < 10μm application Advanced Packaging Thermo-Compression Bonding(TCB) Flip-Chip High Bandwidth Memory(HBM)