Products
HBM
pulse
heaters
overview
HBM PULSE HEATERS are used in Thermo-Compression Bonding(TCB) processes to instantaneously jump between room temperature and 400°C.
operating temperature
SiC < 300℃ per sec
characteristics
Rapid heating & cooling
application
Advanced Packaging
Thermo-Compression Bonding(TCB)
Flip-Chip
High Bandwidth Memory(HBM)