ESC is a key component that uses electrostatic force to secure the wafer and built-in heat circuits to control its processing temperature and temperature uniformity.
BOBOO HITECH provides cleaning, repairing, and manufacturing services of ESCs with technology to bond and de-bond the electrode plate and heater.
operating temperature
AlN < 400℃
Al₂O₃ < 100℃
application
Etching
Chemical Vapor Deposition(CVD)
Physical Vapor Deposition(PVD)
Ion Implantation
types & sizes
BOBOO HITECH offers numerous design options for ESCs.
chucking type
coulomb
Chucking Force occurs between ESC and dielectric layer
Chucking Force remains independent from temperature variations
Johnsen-Rahbek
Chucking Force occurs in the Microspace between ESC and wafer
Chucking Force remains high even in low voltage operations
electrode / pole type
monopolar
Single electrode to clamp wafer
bipolar
Contrasting electrodes to clamp wafer with strong electrical attraction
Multipolar
Three different electrodes to clamp wafer with even stronger electrical attraction